Impact of High Pressures on Au-Sn Solid Liquid Interdiffusion (SLID) Bonds

Bolstad, Per Kristian; Kuziora, Stephane; Nguyen, Hoang-Vu; Manh, Tung; Aasmundtveit, Knut; Hoff, Lars
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https://hdl.handle.net/11250/3010240
Date
2020
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Original version
Bolstad, P. K., Kuziora, S. L., Nguyen, H. V., Manh, T., Aasmundtveit, K. E., & Hoff, L. (2020, September 15-18). Impact of High Pressures on Au-Sn Solid Liquid Interdiffusion (SLID) Bonds [Conference presentation]. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Tønsberg.   https://doi.org/10.1109/ESTC48849.2020.9229855
Abstract
This paper investigates the influence of high pressure on Au-Sn solid-liquid interdiffusion (SLID) bonds formed by bonding Si substrates to dies of either lead-zirconate titanate (PZT) with high surface roughness or Si with low surface roughness. Bonded samples were exposed to 1000 bar pressure in a silicone oil filled pressure vessel. Samples were characterized before and after exposure by means of scanning acoustic microscopy, optical microscopy and scanning electron microscopy with energy dispersive x-ray spectroscopy. All but one sample successfully passed the pressure exposure. This failed sample had a delamination in the proximity of a large void in the intermetallic layer.
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© 2020 IEEE.