Blar i Publikasjoner fra CRIStin på tidsskrift "2019 IEEE 69th Electronic Components and Technology Conference (ECTC)"
Viser treff 1-1 av 1
-
Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications
(Chapter, 2019)Solid-Liquid InterDiffusion (SLID) bonding is particularly suited for high-temperature applications, since SLID bonds can tolerate higher temperatures than the bonding temperature. SLID uses a layered binary metal structure, ...