| dc.contributor.author | Luu, Thi Thuy | |
| dc.date.accessioned | 2015-07-02T06:12:35Z | |
| dc.date.available | 2015-07-02T06:12:35Z | |
| dc.date.issued | 2015 | |
| dc.identifier.isbn | 978-82-7860-257-7 | |
| dc.identifier.issn | 1894-7530 | |
| dc.identifier.uri | http://hdl.handle.net/11250/286253 | |
| dc.description.abstract | The trend of micro-electronic-mechanical-systems (MEMS) packaging requires costeffective and high performance packaging techniques. The objective of this study is to develop solid-liquid-interdiffusion (SLID) wafer-level bonding, a promised cost effective and high performance bonding technique for MEMS packaging. Two techniques were addressed: Cu-Sn SLID and Au-In SLID bonding.
The main contributions are:
- Fully characterization of intermetallic formation during the Cu-Sn bonding process
- Development of a numerical simulation model for IMCs thickness development during a Cu-Sn and Au-In bonding process, which could be used as a tool for process design and optimization
- Development of an in-house process for Cu-Sn and Au-In SLID wafer-level bonding
- Fabrication and testing of Cu-Sn and Au-In SLID wafer-level bonding, perform mechanical integrity test at high temperature
- Propose new methods for fracture characterization Investigation of voids formation during the Cu-Sn SLID bonding process | nb_NO |
| dc.language.iso | eng | nb_NO |
| dc.relation.ispartofseries | Doctoral theses at Buskerud and Vestfold University College;5 | |
| dc.relation.haspart | I: Thi-Thuy Luu, Ani Duan, Kaiying Wang, Knut E. Aasmundtveit and Nils Hoivik, “Optimization of Cu/Sn wafer-level bonding based upon intermetallic characterization”, 4th Electronic System-Integration Technology Conference (ESTC 2012), September 17-20, 2012, Amsterdam, Netherland. | nb_NO |
| dc.relation.haspart | II: Thi-Thuy Luu, Ani Duan, Knut E. Aasmundtveit and Nils Hoivik, “Optimized Cu/Sn wafer-level bonding using intermetallic phase characterization”, Journal of Electronic Materials 2013, Vol 42(12), 2013, pp. 3582-3592 | nb_NO |
| dc.relation.haspart | III: Thi-Thuy Luu, Ani Duan, Kaiying Wang, Knut E. Aasmundtveit and Nils Hoivik, “Cu/Sn SLID wafer-level bonding optimization”, proceeding of Electronic Components and Technology Conference (ECTC), 2013 63rd, May 28-31 2013, pp. 1531-1537. | nb_NO |
| dc.relation.haspart | IV: Ani Duan, Thi Thuy Luu, Kaiying Wang, Knut E. Aasmundtveit and Nils Hoivik, “Wafer-level hermetical Cu/Sn micro-joints with high mechanical strength and low Sn flow”, submitted to Journal of Micromechanics and Microengineering. | nb_NO |
| dc.relation.haspart | V: Thi Thuy Luu, Nils Hoivik, Kaiying Wang, Knut E. Aasmundtveit and Astrid-Sofie B. Vardøy, “Cu/Sn SLID wafer-level bonding for high temperature application”, manuscript accepted to be published on Metallurgical and Materials Transactions A | nb_NO |
| dc.relation.haspart | VI: Thi Thuy Luu, Nils Hoivik, Kaiying Wang, Knut E. Aasmundtveit and Astrid-Sofie Vardoy, “Characterization of wafer-level Au-In bonded samples at elevated temperatures”, Metallurgical and Materials Transactions AJune 2015, Volume 46, Issue 6, pp 2637-2645 | nb_NO |
| dc.subject | MEMS | nb_NO |
| dc.subject | Packaging | nb_NO |
| dc.title | Solid liquid interdiffusion wafer-level bonding for MEMS packaging | nb_NO |
| dc.type | Doctoral thesis | nb_NO |
| dc.subject.nsi | VDP::Technology: 500::Electrotechnical disciplines: 540::Electronics: 541 | nb_NO |
| dc.source.pagenumber | 108 | nb_NO |
| dc.relation.project | IMST-HBV: 08603; Norwegian Research Council, Oslofjordproject: 38068; Oslofjordfundet: 208929; Norwegian PhD Network on Nanotechnology for Microsystems through Norfab: 197411/V30 | nb_NO |
