Solid liquid interdiffusion wafer-level bonding for MEMS packaging
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The trend of micro-electronic-mechanical-systems (MEMS) packaging requires costeffective and high performance packaging techniques. The objective of this study is to develop solid-liquid-interdiffusion (SLID) wafer-level bonding, a promised cost effective and high performance bonding technique for MEMS packaging. Two techniques were addressed: Cu-Sn SLID and Au-In SLID bonding. The main contributions are: - Fully characterization of intermetallic formation during the Cu-Sn bonding process - Development of a numerical simulation model for IMCs thickness development during a Cu-Sn and Au-In bonding process, which could be used as a tool for process design and optimization - Development of an in-house process for Cu-Sn and Au-In SLID wafer-level bonding - Fabrication and testing of Cu-Sn and Au-In SLID wafer-level bonding, perform mechanical integrity test at high temperature - Propose new methods for fracture characterization Investigation of voids formation during the Cu-Sn SLID bonding process
Has partsI: Thi-Thuy Luu, Ani Duan, Kaiying Wang, Knut E. Aasmundtveit and Nils Hoivik, “Optimization of Cu/Sn wafer-level bonding based upon intermetallic characterization”, 4th Electronic System-Integration Technology Conference (ESTC 2012), September 17-20, 2012, Amsterdam, Netherland.
II: Thi-Thuy Luu, Ani Duan, Knut E. Aasmundtveit and Nils Hoivik, “Optimized Cu/Sn wafer-level bonding using intermetallic phase characterization”, Journal of Electronic Materials 2013, Vol 42(12), 2013, pp. 3582-3592
III: Thi-Thuy Luu, Ani Duan, Kaiying Wang, Knut E. Aasmundtveit and Nils Hoivik, “Cu/Sn SLID wafer-level bonding optimization”, proceeding of Electronic Components and Technology Conference (ECTC), 2013 63rd, May 28-31 2013, pp. 1531-1537.
IV: Ani Duan, Thi Thuy Luu, Kaiying Wang, Knut E. Aasmundtveit and Nils Hoivik, “Wafer-level hermetical Cu/Sn micro-joints with high mechanical strength and low Sn flow”, submitted to Journal of Micromechanics and Microengineering.
V: Thi Thuy Luu, Nils Hoivik, Kaiying Wang, Knut E. Aasmundtveit and Astrid-Sofie B. Vardøy, “Cu/Sn SLID wafer-level bonding for high temperature application”, manuscript accepted to be published on Metallurgical and Materials Transactions A
VI: Thi Thuy Luu, Nils Hoivik, Kaiying Wang, Knut E. Aasmundtveit and Astrid-Sofie Vardoy, “Characterization of wafer-level Au-In bonded samples at elevated temperatures”, Metallurgical and Materials Transactions AJune 2015, Volume 46, Issue 6, pp 2637-2645