Design and Fabrication of on-chip heating for Electric Substitution Radiometer
Abstract
This thesis describes the design, simulations, and fabrication of heating resistors by the
photolithography process, and finally integration of a selected resistor through a bonding
procedure to the backside of a photodiode. TiW (90/10%) is used for resistor lines and
Au is used for resistor pads. The fabricated resistors are integrated into an electric
substitution radiometer (ESR) equipped with a predictable quantum efficient detector
(PQED) to assemble a dual-mode detector module (DMD).
This research project is part of the European research project chipS·CALe [1], which is
in close collaboration with Justervesenet, Norway's metrology institute. The goal of this
research is to develop high-precision optical power measurement techniques using silicon
photodiodes.
After describing the process of the integration of the heating resistor onto the backside of
the photodiode, the assembly of the dual-mode detector module will be explained. This
is where a mix of wire bonding techniques and silver conductive epoxy were used to make
a connection between the bottom printed circuit board (PCB) and the top PCB (attached
to photodiode with resistor).