dc.contributor.author | Aasmundtveit, Knut | |
dc.contributor.author | Luu, Thi Thuy | |
dc.contributor.author | Nguyen, Hoang-Vu | |
dc.contributor.author | Larsson, Andreas | |
dc.contributor.author | Tollefsen, Torleif Andre | |
dc.date.accessioned | 2019-02-18T09:28:34Z | |
dc.date.available | 2019-02-18T09:28:34Z | |
dc.date.created | 2019-02-15T09:07:30Z | |
dc.date.issued | 2018 | |
dc.identifier.isbn | 978-1-78923-179-3 | |
dc.identifier.uri | http://hdl.handle.net/11250/2585852 | |
dc.description | This chapter is distributed under the terms of the Creative which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited Commons Attribution Licens. | nb_NO |
dc.description.abstract | Solid-liquid interdiffusion (SLID) bonding for microelectronics and microsystems is a bonding technique relying on intermetallics. The high-melting temperature of intermetallics allows for system operation at far higher temperatures than what solder-bonded systems can do, while still using similar process temperatures as in common solder processes. Additional benefits of SLID bonding are possibilities of fine-pitch bonding, as well as thin-layer metallurgical bonding. Our group has worked on a number of SLID metal systems. We have optimized wafer-level Cu-Sn SLID bonding to become an industrially feasible process, and we have verified the reliability of Au-Sn SLID bonding in a thermally mismatched system, as well as determined the actual phases present in an Au-Sn SLID bond. We have demonstrated SLID bonding for very high temperatures (Ni-Sn, having intermetallics with melting points up to 1280°C), as well as SLID with low process temperatures (Au-In, processed at 180°C, and Au-In-Bi, processed at 90–115°C). We have verified experimentally the high-temperature stability for our systems, with quantified strength at temperatures up to 300°C for three of the systems: Cu-Sn, Au-Sn and Au-In. | nb_NO |
dc.language.iso | eng | nb_NO |
dc.relation.ispartof | Intermetallic compounds : formation and applications | |
dc.rights | Navngivelse 4.0 Internasjonal | * |
dc.rights.uri | http://creativecommons.org/licenses/by/4.0/deed.no | * |
dc.title | Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding | nb_NO |
dc.type | Chapter | nb_NO |
dc.description.version | publishedVersion | nb_NO |
dc.rights.holder | © 2018 The Author(s). | nb_NO |
dc.source.pagenumber | 43-72 | nb_NO |
dc.identifier.doi | 10.5772/intechopen.75139 | |
dc.identifier.cristin | 1677520 | |
cristin.unitcode | 222,58,4,0 | |
cristin.unitname | Institutt for mikrosystemer | |
cristin.ispublished | true | |
cristin.fulltext | original | |
cristin.qualitycode | 1 | |