Blar i Institutt for mikrosystemer på dokumenttype "Chapter"
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A Clover shaped silicon piezoresistive microphone for miniaturized photoacoustic gas sensors
(Chapter, 2009)Here we present the design and modeling of a novel piezoresistive microphone designed for a photoacoustic gas sensor system. The microphone is fabricated using a novel process to enable DRIE etch through of membranes of ... -
Bipolar photodiode module operated at 4 K
(Chapter, 2020)An optoelectronic module for generating high frequency bipolar current pulses at 4 K was developed. Bipolar signals are generated by connecting a pair of photodiodes in series to coplanar waveguides on silicon. The ... -
Carbon Nanotubes Directly Integrated in CMOS by Local Synthesis - Towards a Wafer-Level Process
(Chapter, 2019)Integrating nanomaterials in electronic circuitry and in microsystems is highly desired for fully exploiting the functionality of nanomaterials such as Carbon Nanotubes (CNTs), utilizing the signal processing of ... -
Design of a switchable driving coil for Magnetic Resonance Wireless Power Transfer
(Chapter; Peer reviewed, 2019)This paper presents design and analysis of a switchable inductor suited for active impedance matching in magnetic resonance wireless power transfer systems. The switchable inductor is compact and can be used as both driving ... -
Detection of Ungrounded Objects on Mutual Capacitance Touch Screens
(Chapter, 2015)Mutual capacitance touch screens are responsible for detecting billions of human fingers touching them around the world every day. Being able to use such screens for detection of ungrounded objects as well, would make it ... -
Evaluation of Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays
(Chapter, 2020)Hermetic packaging is a critical requirement for microbolometers to maintain long-term reliability. A thinner diaphragm is desirable for vacuum packaging of microbolometers to obtain higher infrared light transmission. ... -
High-energy X-ray Tomography for 3D Void Characterization in Au–Sn Solid-Liquid Interdiffusion (SLID) Bonds
(Chapter, 2019)Au-Sn SLID bonding is a technique originally developed for harsh environment applications. The technology has recently shown promising results for ultrasound transducer fabrication. Characterizing the spatial and size ... -
Impact of High Pressures on Au-Sn Solid Liquid Interdiffusion (SLID) Bonds
(Chapter, 2020)This paper investigates the influence of high pressure on Au-Sn solid-liquid interdiffusion (SLID) bonds formed by bonding Si substrates to dies of either lead-zirconate titanate (PZT) with high surface roughness or Si ... -
Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding
(Chapter, 2018)Solid-liquid interdiffusion (SLID) bonding for microelectronics and microsystems is a bonding technique relying on intermetallics. The high-melting temperature of intermetallics allows for system operation at far higher ... -
Joint International Master in Smart Systems Integrated Solutions
(Chapter, 2021)The Joint International Master in Smart Systems Integrated Solutions (SSIs) will graduate candidates for the ever-growing industry of Smart Systems, ubiquitous in all sectors of society including healthcare, transport, ... -
A Look-Ahead Based Meta-Heuristics for Optimizing Continuous Optimization Problems
(Chapter; Peer reviewed, 2022)In this paper, the famous kernighan-Lin algorithm is adjusted and embedded into the simulated annealing algorithm and the genetic algorithm for continuous optimization problems. The performance of the different algorithms ... -
Nano-Power Monostable-Based Wake-Up Mechanism for Wireless Sensor Networks
(Chapter, 2022)Wireless sensor networks (WSNs) generally consist of thousands of sensor nodes, each one supplied by a battery or harvested energy. To prolong the lifetime of wireless sensor networks, wake-up receivers (WuRxs) are typically ... -
New Encapsulation Concepts for Medical Ultrasound Probes – A Heat Transfer Simulation Study
(Chapter, 2019)Thermal management is important for medical ultrasound probes to maintain optimal performance, reliability, and lifetime of the devices, as well as to avoid heat-induced damage to the patients’ tissue. This paper presents ... -
A Novel Framework To Evaluate and Train Object Detection Models for Real-Time Victims Search and Rescue at Sea With Autonomous Unmanned Aerial Systems Using High-Fidelity Dynamic Marine Simulation Environment
(Chapter, 2023)This work presents a novel framework providing the ability to control an Unmanned Aerial System (UAS) while detecting objects in real-time with visible detections, containing class names, bounding boxes, and confidence ... -
An Oscillator-Based Wake-Up Receiver for Wireless Sensor Networks
(Chapter, 2021)The Internet of Things (IoT) concept is mainly enabled by wireless sensor networks (WSNs), which are continuously gaining attention, due to their multidisciplinary applications. To enhance the WSNs energy efficiency, ... -
Performance Analyses of a 454 kWp Grid-Connected Rooftop Photovoltaic System in Southern Norway
(Chapter, 2020)This paper analyzes and compares the actual measured and simulated performance of a 454 kWp grid-connected photovoltaic system installed on the rooftop of the university building. The data presented in this study were ... -
Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices
(Chapter, 2019)Reworkable anisotropic conductive adhesives (ACAs) are of interest when the material is used for the assembly of electronic modules with high value, such as in medical ultrasound probes. Commercially available ACAs are ... -
Simulated effects of wet-etched induced surface roughness on IR transmission and reflection
(Chapter, 2020)We have constructed a finite element simulation where we investigate the effects of wet-etch-induced surface roughness on transmission and reflection of infrared light in the 8-12um band. A silicon wafer was wet-etched for ... -
Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications
(Chapter, 2019)Solid-Liquid InterDiffusion (SLID) bonding is particularly suited for high-temperature applications, since SLID bonds can tolerate higher temperatures than the bonding temperature. SLID uses a layered binary metal structure, ... -
A Strategy for Drone Traffic Planning Dynamic Flight-paths for Drones in Smart Cities
(Chapter, 2019)This paper presents a solution for creating dynamic flight plans for drones. The number of drones is expected to increase dramatically, and there will be a demand for drone traffic planning solutions. The approach used ...