| dc.description.abstract | The present book is primarily meant for university education in introductory electronic packaging technology. We attempt to give an overview that encompasses aspects of material technology, metallurgy, chemistry, physical properties, and mechanical properties. An understanding of the interplay of all these basic fields is necessary for choosing and using the available technologies in a best possible way in combination with a good design to get a product with the right quality. We describe component technologies, basic processing methods, design guidelines, the production of printed circuit boards and the common hybrid technologies, including multichip modules. | nb_NO |
