Blar i Institutt for mikrosystemer på forfatter "Le, Anh Duy"
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Intermetallic bonding as an alternative to polymeric adhesives in ultrasound transducers
Bolstad, Per Kristian; Le, Anh Duy; Hoff, Lars; Manh, Tung (Peer reviewed; Journal article, 2019)Common ultrasound transducers utilize epoxy for bonding the active piezoelectric to the rest of the acoustic stack. This paper explores some of the potential benefits of replacing this soft epoxy layer with a harder ...