Browsing Institutt for mikrosystemer by Author "Aasmundtveit, Knut Eilif"

Now showing items 1-10 of 10

    • Ag–(In–Bi) solid-state bonding 

      Kuziora, Stephane; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif (Peer reviewed; Journal article, 2023)
      Solid-state diffusion bonding is a metallurgical technique to bond interfaces. We identify Ag–(In–Bi) as a material system that can be bonded at 65 °C. This work aims to demonstrate low-temperature bonding and to determine ...

    • Assembly of Ultra-thin MEMS Device on Driver Chip Using Anisotropic Conductive Film 

      Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif (Chapter, 2024)
      Assembly solution for large-area, ultra-thin, MEMS-based transducer array dies on driver chips has been investigated using dummy Si dies and substrates. The dummy dies have a thickness of 50 µm, a bonding area on the order ...

    • Carbon Nanotube Growth on the Polysilicon Layers of CMOS 

      Roy, Avisek; Aasmundtveit, Knut Eilif (Peer reviewed; Journal article, 2023)
      Direct synthesis of CNTs in an established IC technology such as CMOS can effectively utilize CNT properties in smart sensing applications. With that vision, we designed and fabricated polysilicon microheaters in CMOS chips ...

    • Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays 

      Xia, Hexin; Akram, Muhammad Nadeem; Roy, Avisek; Bardalen, Eivind; Nguyen, Hoang Vu; Hoivik, Nils; Aasmundtveit, Knut Eilif; Ohlckers, Per (Peer reviewed; Journal article, 2021)
      A microbolometer array is used as a detector in an infrared camera. It converts the temperature change induced by the incoming longwave infrared light into an electrical signal for obtaining the thermal image information. ...

    • Flip-chip interconnects based on single metal-coated polymer spheres 

      Huynh, Van Long; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu (Chapter, 2024)
      In microelectronics packaging, minimizing thermo-mechanical stresses is crucial to achieve high reliability. This paper presents a novel approach for flip-chip interconnects, utilizing individual metal-coated polymer spheres ...

    • Joint International Master in Smart Systems Integrated Solutions 

      Aasmundtveit, Knut Eilif; Wang, Changhai; Rencz, Márta; Paulasto-Krockel, Mervi; Imenes, Kristin; Desmulliez, Marc P.Y.; Ender, Ferenc; vuorinen, vesa (Chapter, 2021)
      The Joint International Master in Smart Systems Integrated Solutions (SSIs) will graduate candidates for the ever-growing industry of Smart Systems, ubiquitous in all sectors of society including healthcare, transport, ...

    • Post-CMOS processing challenges and design developments of CMOS-MEMS microheaters for local CNT synthesis 

      Roy, Avisek; Ta, Bao Quoc; Azadmehr, Mehdi; Aasmundtveit, Knut Eilif (Peer reviewed; Journal article, 2023)
      Carbon nanotubes (CNTs) can be locally grown on custom-designed CMOS microheaters by a thermal chemical vapour deposition (CVD) process to utilize the sensing capabilities of CNTs in emerging micro- and nanotechnology ...

    • Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration 

      Wernicke, Tobias; Rebhan, Bernhard; Vuorinen, Vesa; Paulasto-Krockel, Mervi; Dubey, Vikas; Diex, Kevin; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Tanaka, Shuji; Froemel, Joerg; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Dragoi, Viorel (Peer reviewed; Journal article, 2023)
      An overview of various low temperature (<200°C) wafer bonding processes using metal interlayers is presented. Such processes are very attractive for novel applications in 3D heterogenous packaging as the allow for simultaneous ...

    • Thermal Conductivity and Mechanical Properties of Polymer Composites with Hexagonal Boron Nitride—A Comparison of Three Processing Methods: Injection Moulding, Powder Bed Fusion and Casting 

      Do, Nu Bich Duyen; Imenes, Kristin; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Andreassen, Erik (Peer reviewed; Journal article, 2023)
      Materials providing heat dissipation and electrical insulation are required for many electronic and medical devices. Polymer composites with hexagonal boron nitride (hBN) may fulfil such requirements. The focus of this ...

    • Thermally conductive polymer composites With hexagonal boron nitride for medical device thermal management 

      Do, Nu Bich Duyen; Imenes, Kristin; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Andreassen, Erik (Chapter, 2024)
      Polymer composites with hexagonal boron nitride (hBN) have the potential to meet the heat dissipation and electrical insulation requirements of electronic and medical devices. In this study, hBN/polymer composites were ...