Blar i 1 USN ansatte på tidsskrift "IEEE Transactions on Components, Packaging, and Manufacturing Technology"

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    • Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays 

      Xia, Hexin; Akram, Muhammad Nadeem; Roy, Avisek; Bardalen, Eivind; Nguyen, Hoang Vu; Hoivik, Nils; Aasmundtveit, Knut Eilif; Ohlckers, Per (Peer reviewed; Journal article, 2021)
      A microbolometer array is used as a detector in an infrared camera. It converts the temperature change induced by the incoming longwave infrared light into an electrical signal for obtaining the thermal image information. ...

    • Off-eutectic Au-Ge die-attach - Microstructure, mechanical strength, and electrical resistivity 

      Larsson, Andreas; Thoresen, Christian Bjørge (Peer reviewed; Journal article, 2019)
      In this paper, off-eutectic Au–Ge joints were formed between Si substrates to investigate their high-temperature compatibility. High-quality joints made with small bond pressure, 53 kPa, were fabricated. The joints comprised ...