Browsing Applied Micro- and Nanosystems by Subject "VDP::Technology: 500::Electrotechnical disciplines: 540::Electronics: 541"
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Solid liquid interdiffusion wafer-level bonding for MEMS packaging
(Doctoral theses at Buskerud and Vestfold University College;5, Doctoral thesis, 2015)The trend of micro-electronic-mechanical-systems (MEMS) packaging requires costeffective and high performance packaging techniques. The objective of this study is to develop solid-liquid-interdiffusion (SLID) wafer-level ...