Blar i USN Open Archive på forfatter "Nguyen, Hoang-Vu"
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Ag–(In–Bi) solid-state bonding
Kuziora, Stephane; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif (Peer reviewed; Journal article, 2023)Solid-state diffusion bonding is a metallurgical technique to bond interfaces. We identify Ag–(In–Bi) as a material system that can be bonded at 65 °C. This work aims to demonstrate low-temperature bonding and to determine ... -
Anisotropic conductive film for flip-chip interconnection of a high I/O silicon based finger print sensor
Larsson, Andreas; Oldervoll, Frøydis; Seip, Torleif Andre Tollefsen; Nguyen, Hoang-Vu; Kristiansen, Helge; Sløgedal, Øyvind (Lecture, 2011)Anisotropic conductive film (ACF) has been used for flip chip interconnection of a silicon based MEMS finger print sensor to a signal processing ASIC. The assembled sensor device was subjected to a short term high temperature ... -
BrainChip - Development of flip chip process compatible with COTS components and interposer to enable 2.5D integration
Bjerkelund, Jonas (Master thesis, 2023) -
Electrical characterization of individual metal-coated polymer spheres used in isotropic conductive adhesives
Nguyen, Hoang-Vu; He, Jianying; Helland, Tore; Kristiansen, Helge; Aasmundtveit, Knut (Journal article; Peer reviewed, 2016)Isotropic conductive adhesives (ICAs) filled with metal-coated polymer spheres (MPS) have been proposed to improve the mechanical reliability compared to conventional ICAs filled with silver flakes. The electrical properties ... -
High-energy X-ray Tomography for 3D Void Characterization in Au–Sn Solid-Liquid Interdiffusion (SLID) Bonds
Aasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu (Chapter, 2019)Au-Sn SLID bonding is a technique originally developed for harsh environment applications. The technology has recently shown promising results for ultrasound transducer fabrication. Characterizing the spatial and size ... -
Impact of High Pressures on Au-Sn Solid Liquid Interdiffusion (SLID) Bonds
Bolstad, Per Kristian; Kuziora, Stephane; Nguyen, Hoang-Vu; Manh, Tung; Aasmundtveit, Knut; Hoff, Lars (Chapter, 2020)This paper investigates the influence of high pressure on Au-Sn solid-liquid interdiffusion (SLID) bonds formed by bonding Si substrates to dies of either lead-zirconate titanate (PZT) with high surface roughness or Si ... -
Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding
Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre (Chapter, 2018)Solid-liquid interdiffusion (SLID) bonding for microelectronics and microsystems is a bonding technique relying on intermetallics. The high-melting temperature of intermetallics allows for system operation at far higher ... -
New Encapsulation Concepts for Medical Ultrasound Probes – A Heat Transfer Simulation Study
Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Nguyen, Hoang-Vu; Aasmundtveit, Knut; Imenes, Kristin (Chapter, 2019)Thermal management is important for medical ultrasound probes to maintain optimal performance, reliability, and lifetime of the devices, as well as to avoid heat-induced damage to the patients’ tissue. This paper presents ... -
Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
Wernicke, Tobias; Rebhan, Bernhard; Vuorinen, Vesa; Paulasto-Krockel, Mervi; Dubey, Vikas; Diex, Kevin; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Tanaka, Shuji; Froemel, Joerg; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Dragoi, Viorel (Peer reviewed; Journal article, 2023)An overview of various low temperature (<200°C) wafer bonding processes using metal interlayers is presented. Such processes are very attractive for novel applications in 3D heterogenous packaging as the allow for simultaneous ... -
Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices
Nguyen, Hoang-Vu; Kristiansen, Helge; Lifjeld, Anders; Imenes, Kristin; Aasmundtveit, Knut (Chapter, 2019)Reworkable anisotropic conductive adhesives (ACAs) are of interest when the material is used for the assembly of electronic modules with high value, such as in medical ultrasound probes. Commercially available ACAs are ... -
Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications
Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre (Chapter, 2019)Solid-Liquid InterDiffusion (SLID) bonding is particularly suited for high-temperature applications, since SLID bonds can tolerate higher temperatures than the bonding temperature. SLID uses a layered binary metal structure, ... -
Thermal Conductivity and Mechanical Properties of Polymer Composites with Hexagonal Boron Nitride—A Comparison of Three Processing Methods: Injection Moulding, Powder Bed Fusion and Casting
Do, Nu Bich Duyen; Imenes, Kristin; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Andreassen, Erik (Peer reviewed; Journal article, 2023)Materials providing heat dissipation and electrical insulation are required for many electronic and medical devices. Polymer composites with hexagonal boron nitride (hBN) may fulfil such requirements. The focus of this ... -
Thermal management of an interventional medical device with double layer encapsulation
Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Aasmundtveit, Knut; Nguyen, Hoang-Vu; Imenes, Kristin (Peer reviewed; Journal article, 2021)This paper presents a thermal study of a double-layer encapsulation for an interventional medical device, which operates temporarily inside the human esophagus for cardiac imaging. The surface temperature of test samples, ... -
Wafer Level Capping Technology for Vacuum Packaging of Microbolometers
Zoschke, Kai; Manier, Charles Alix; Oppermann, Hermann; Meier, Dirk; Malik, Nishant; Zakizade, Elahe; Michel, Marvin; Roy, Avisek; Nguyen, Hoang-Vu; Nguyen, Thanh Phuc (Chapter, 2023)This paper presents novel technology developments for vacuum wafer level packaging of microbolometer arrays for thermal infrared sensors targeting applications in automotive, safety, and security/surveillance. The concept ...