• A Clover shaped silicon piezoresistive microphone for miniaturized photoacoustic gas sensors 

      Grinde, Christopher; Øhlckers, Per; Mielnik, M.; Jensen, Geir Uri; Wang, DT (Chapter, 2009)
      Here we present the design and modeling of a novel piezoresistive microphone designed for a photoacoustic gas sensor system. The microphone is fabricated using a novel process to enable DRIE etch through of membranes of ...
    • Improved packaging techniques for LWIR microbolometers 

      Papatzacos, Phillip (Doctoral dissertations at the University of South-Eastern Norway;164, Doctoral thesis, 2023)
      A new generation of Infrared (IR) camera sensors, based on MicroBolometer Arrays (MBA) has been developed. This technology is lower cost and has no need for active cooling, unlike the previous generation. It, therefore, ...
    • Solid liquid interdiffusion wafer-level bonding for MEMS packaging 

      Luu, Thi Thuy (Doctoral theses at Buskerud and Vestfold University College;5, Doctoral thesis, 2015)
      The trend of micro-electronic-mechanical-systems (MEMS) packaging requires costeffective and high performance packaging techniques. The objective of this study is to develop solid-liquid-interdiffusion (SLID) wafer-level ...