| dc.contributor.author | Langøy, Rune | |
| dc.contributor.author | Lien, Jørgen | |
| dc.contributor.author | Nguyen Thai, Anh Tuan | |
| dc.contributor.author | Mager, Magnus | |
| dc.date.accessioned | 2020-11-23T13:53:57Z | |
| dc.date.available | 2020-11-23T13:53:57Z | |
| dc.date.created | 2020-11-20T11:01:26Z | |
| dc.date.issued | 2020 | |
| dc.identifier.citation | Langøy, R., Mager, M., Nguyen, A. T. T., & Lien, J. A. (2020, 15.-18. september). Thinning and readout during bending of a custom silicon IC. I K. Aasmundtveit, K. Imenes & P. M. Svasta (Red.), 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (s. 1-5). IEEE. | en_US |
| dc.identifier.isbn | 978-1-7281-6293-5 | |
| dc.identifier.uri | https://hdl.handle.net/11250/2689158 | |
| dc.description.abstract | This contribution presents a solution on how to interconnect, thin and bend a monolithic integrated circuit (IC) for use in the Inner Tracker System v3 (ITS3) of the ALICE experiment at the European Organization for Nuclear Research (CERN). Verification of the system operations was done by building a dedicated readout system. The technology is demonstrated by thinning a 30 mm x 15 mm x 130 μm monolithic active pixel sensor to 45 μm and curving the chip to a radius of 20 mm while monitoring the internal registers and current consumption. | en_US |
| dc.language.iso | eng | en_US |
| dc.relation.ispartof | 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) | |
| dc.title | Thinning and readout during bending of a custom silicon IC | en_US |
| dc.type | Chapter | en_US |
| dc.description.version | acceptedVersion | en_US |
| dc.rights.holder | © 2020 IEEE. | en_US |
| dc.identifier.doi | https://doi.org/10.1109/ESTC48849.2020.9229845 | |
| dc.identifier.cristin | 1850299 | |
| dc.relation.project | Universitetet i Sørøst-Norge: 245963 | en_US |
| cristin.ispublished | true | |
| cristin.fulltext | original | |
| cristin.qualitycode | 1 | |
