• Solid liquid interdiffusion wafer-level bonding for MEMS packaging 

      Luu, Thi Thuy (Doctoral theses at Buskerud and Vestfold University College;5, Doctoral thesis, 2015)
      The trend of micro-electronic-mechanical-systems (MEMS) packaging requires costeffective and high performance packaging techniques. The objective of this study is to develop solid-liquid-interdiffusion (SLID) wafer-level ...