Browsing Publikasjoner fra CRIStin by Journals "IEEE Transactions on Components, Packaging, and Manufacturing Technology"
Now showing items 1-1 of 1
(Peer reviewed; Journal article, 2019)In this paper, off-eutectic Au–Ge joints were formed between Si substrates to investigate their high-temperature compatibility. High-quality joints made with small bond pressure, 53 kPa, were fabricated. The joints comprised ...