Blar i USN Open Archive på forfatter "Tollefsen, Torleif Andre"

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    • A Review of Eutectic Au-Ge Solder Joints 

      Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut (Journal article; Peer reviewed, 2019)
      Gold-germanium (Au-Ge) joints have been part of the electronics industry since the birth of the solid state transistor. Today they find their role as a reliable joining technology, especially for high-temperature applications. ...

    • Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding 

      Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre (Chapter, 2018)
      Solid-liquid interdiffusion (SLID) bonding for microelectronics and microsystems is a bonding technique relying on intermetallics. The high-melting temperature of intermetallics allows for system operation at far higher ...

    • Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications 

      Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre (Chapter, 2019)
      Solid-Liquid InterDiffusion (SLID) bonding is particularly suited for high-temperature applications, since SLID bonds can tolerate higher temperatures than the bonding temperature. SLID uses a layered binary metal structure, ...