Blar i USN Open Archive på forfatter "Luu, Thi Thuy"
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Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding
Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre (Chapter, 2018)Solid-liquid interdiffusion (SLID) bonding for microelectronics and microsystems is a bonding technique relying on intermetallics. The high-melting temperature of intermetallics allows for system operation at far higher ... -
Solid liquid interdiffusion wafer-level bonding for MEMS packaging
Luu, Thi Thuy (Doctoral theses at Buskerud and Vestfold University College;5, Doctoral thesis, 2015)The trend of micro-electronic-mechanical-systems (MEMS) packaging requires costeffective and high performance packaging techniques. The objective of this study is to develop solid-liquid-interdiffusion (SLID) wafer-level ... -
Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications
Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre (Chapter, 2019)Solid-Liquid InterDiffusion (SLID) bonding is particularly suited for high-temperature applications, since SLID bonds can tolerate higher temperatures than the bonding temperature. SLID uses a layered binary metal structure, ...