Browsing USN Open Archive by Author "Larsson, Andreas"

Now showing items 1-7 of 7

    • A Review of Eutectic Au-Ge Solder Joints 

      Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut (Journal article; Peer reviewed, 2019)
      Gold-germanium (Au-Ge) joints have been part of the electronics industry since the birth of the solid state transistor. Today they find their role as a reliable joining technology, especially for high-temperature applications. ...

    • Anisotropic conductive film for flip-chip interconnection of a high I/O silicon based finger print sensor 

      Larsson, Andreas; Oldervoll, Frøydis; Seip, Torleif Andre Tollefsen; Nguyen, Hoang-Vu; Kristiansen, Helge; Sløgedal, Øyvind (Lecture, 2011)
      Anisotropic conductive film (ACF) has been used for flip chip interconnection of a silicon based MEMS finger print sensor to a signal processing ASIC. The assembled sensor device was subjected to a short term high temperature ...

    • Die-attach for high-temperature electronics 

      Larsson, Andreas (Doctoral thesis, 2019)
      Applications in harsh environments push the boundaries for electronic systems. High temperatures put great stress on electronic components. The die-attach is an enabling component that makes the system work. It needs to ...

    • Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding 

      Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre (Chapter, 2018)
      Solid-liquid interdiffusion (SLID) bonding for microelectronics and microsystems is a bonding technique relying on intermetallics. The high-melting temperature of intermetallics allows for system operation at far higher ...

    • Off-eutectic Au-Ge die-attach - Microstructure, mechanical strength, and electrical resistivity 

      Larsson, Andreas; Thoresen, Christian Bjørge (Peer reviewed; Journal article, 2019)
      In this paper, off-eutectic Au–Ge joints were formed between Si substrates to investigate their high-temperature compatibility. High-quality joints made with small bond pressure, 53 kPa, were fabricated. The joints comprised ...

    • On the Microstructure of Off-Eutectic Au-Ge Joints: A High-Temperature Joint 

      Larsson, Andreas; Aasmundtveit, Knut (Peer reviewed; Journal article, 2019)
      Joining delicate electronic components for high-temperature applications is challenging. Regular soldering with lead-free or lead-based materials is typically not suitable for high-temperature applications due to their low ...

    • Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications 

      Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre (Chapter, 2019)
      Solid-Liquid InterDiffusion (SLID) bonding is particularly suited for high-temperature applications, since SLID bonds can tolerate higher temperatures than the bonding temperature. SLID uses a layered binary metal structure, ...