Blar i USN Open Archive på forfatter "Aasmundtveit, Knut"
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A Review of Eutectic Au-Ge Solder Joints
Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut (Journal article; Peer reviewed, 2019)Gold-germanium (Au-Ge) joints have been part of the electronics industry since the birth of the solid state transistor. Today they find their role as a reliable joining technology, especially for high-temperature applications. ... -
Carbon Nanotubes Directly Integrated in CMOS by Local Synthesis - Towards a Wafer-Level Process
Aasmundtveit, Knut; Roy, Avisek; Ta, Bao Quoc (Chapter, 2019)Integrating nanomaterials in electronic circuitry and in microsystems is highly desired for fully exploiting the functionality of nanomaterials such as Carbon Nanotubes (CNTs), utilizing the signal processing of ... -
Design and fabrication of CMOS microstructures to locally synthesize carbon nanotubes for gas sensing
Roy, Avisek; Azadmehr, Mehdi; Ta, Bao Quoc; Häfliger, Philipp; Aasmundtveit, Knut (Peer reviewed; Journal article, 2019)Carbon nanotubes (CNTs) can be grown locally on custom-designed CMOS microstructures to use them as a sensing material for manufacturing low-cost gas sensors, where CMOS readout circuits are directly integrated. Such a ... -
Direct Synthesis of Carbon Nanotubes in CMOS-Layout of Micro-heaters
Roy, Avisek; Azadmehr, Mehdi; Häfliger, Philipp; Ta, Bao Quoc; Aasmundtveit, Knut (Peer reviewed; Journal article, 2019)Direct integration of Carbon Nanotubes (CNTs) in CMOS is important for commercially manufacturing low-cost CNT-based sensors. In such compact sensors, CNTs would act as sensing element, and CMOS circuits would process ... -
Electrical characterization of individual metal-coated polymer spheres used in isotropic conductive adhesives
Nguyen, Hoang-Vu; He, Jianying; Helland, Tore; Kristiansen, Helge; Aasmundtveit, Knut (Journal article; Peer reviewed, 2016)Isotropic conductive adhesives (ICAs) filled with metal-coated polymer spheres (MPS) have been proposed to improve the mechanical reliability compared to conventional ICAs filled with silver flakes. The electrical properties ... -
Evaluation of Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays
Xia, Hexin; Akram, Muhammad Nadeem; Bardalen, Eivind; Roy, Avisek; Aasmundtveit, Knut; Øhlckers, Per (Chapter, 2020)Hermetic packaging is a critical requirement for microbolometers to maintain long-term reliability. A thinner diaphragm is desirable for vacuum packaging of microbolometers to obtain higher infrared light transmission. ... -
High-energy X-ray Tomography for 3D Void Characterization in Au–Sn Solid-Liquid Interdiffusion (SLID) Bonds
Aasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu (Chapter, 2019)Au-Sn SLID bonding is a technique originally developed for harsh environment applications. The technology has recently shown promising results for ultrasound transducer fabrication. Characterizing the spatial and size ... -
Impact of High Pressures on Au-Sn Solid Liquid Interdiffusion (SLID) Bonds
Bolstad, Per Kristian; Kuziora, Stephane; Nguyen, Hoang-Vu; Manh, Tung; Aasmundtveit, Knut; Hoff, Lars (Chapter, 2020)This paper investigates the influence of high pressure on Au-Sn solid-liquid interdiffusion (SLID) bonds formed by bonding Si substrates to dies of either lead-zirconate titanate (PZT) with high surface roughness or Si ... -
Integration of Carbon Nanotubes in Microsystems: Local Growth and Electrical Properties of Contacts
Haugen, Tormod Bjørnetun; Ta, Bao Quoc; Halvorsen, Einar; Hoivik, Nils; Aasmundtveit, Knut (Journal article; Peer reviewed, 2013)Carbon nanotubes (CNTs) have been directly grown onto a silicon microsystem by a local synthesis method. This method has potential for wafer-level complimentary metal-oxide-semiconductor (CMOS) transistor-compatible ... -
Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding
Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre (Chapter, 2018)Solid-liquid interdiffusion (SLID) bonding for microelectronics and microsystems is a bonding technique relying on intermetallics. The high-melting temperature of intermetallics allows for system operation at far higher ... -
Lightweight Hybrid Packages for Space Electronics
Nordskov, Alexander (Master thesis, 2021)A new lightweight package material for Radio Frequency (RF) hybrid circuits were investigated to complement the currently used FeNiCo (kovar) package material. Kovar is extensively used as a package material for hybrids ... -
Local Synthesis of Carbon Nanotubes in Silicon Microsystems: The Effect of Temperature Distribution on Growth Structure
Ta, Bao Quoc; Haugen, Tormod Bjørnetun; Hoivik, Nils; Halvorsen, Einar; Aasmundtveit, Knut (Journal article; Peer reviewed, 2013)Local synthesis and direct integration of carbon nanotubes (CNTs) into microsystems is a promising method for producing CNT-based devices in a single step, low-cost, and wafer-level, CMOS/MEMS-compatible process. In this ... -
New Encapsulation Concepts for Medical Ultrasound Probes – A Heat Transfer Simulation Study
Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Nguyen, Hoang-Vu; Aasmundtveit, Knut; Imenes, Kristin (Chapter, 2019)Thermal management is important for medical ultrasound probes to maintain optimal performance, reliability, and lifetime of the devices, as well as to avoid heat-induced damage to the patients’ tissue. This paper presents ... -
On the Microstructure of Off-Eutectic Au-Ge Joints: A High-Temperature Joint
Larsson, Andreas; Aasmundtveit, Knut (Peer reviewed; Journal article, 2019)Joining delicate electronic components for high-temperature applications is challenging. Regular soldering with lead-free or lead-based materials is typically not suitable for high-temperature applications due to their low ... -
Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices
Nguyen, Hoang-Vu; Kristiansen, Helge; Lifjeld, Anders; Imenes, Kristin; Aasmundtveit, Knut (Chapter, 2019)Reworkable anisotropic conductive adhesives (ACAs) are of interest when the material is used for the assembly of electronic modules with high value, such as in medical ultrasound probes. Commercially available ACAs are ... -
Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications
Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre (Chapter, 2019)Solid-Liquid InterDiffusion (SLID) bonding is particularly suited for high-temperature applications, since SLID bonds can tolerate higher temperatures than the bonding temperature. SLID uses a layered binary metal structure, ... -
Thermal management of an interventional medical device with double layer encapsulation
Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Aasmundtveit, Knut; Nguyen, Hoang-Vu; Imenes, Kristin (Peer reviewed; Journal article, 2021)This paper presents a thermal study of a double-layer encapsulation for an interventional medical device, which operates temporarily inside the human esophagus for cardiac imaging. The surface temperature of test samples, ...