Blar i USN Open Archive på tidsskrift "IEEE Transactions on Components, Packaging, and Manufacturing Technology"
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Off-eutectic Au-Ge die-attach - Microstructure, mechanical strength, and electrical resistivity
(Peer reviewed; Journal article, 2019)In this paper, off-eutectic Au–Ge joints were formed between Si substrates to investigate their high-temperature compatibility. High-quality joints made with small bond pressure, 53 kPa, were fabricated. The joints comprised ...