Browsing USN Open Archive by Journals "2019 IEEE 69th Electronic Components and Technology Conference (ECTC)"

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    • Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications 

      Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre (Chapter, 2019)
      Solid-Liquid InterDiffusion (SLID) bonding is particularly suited for high-temperature applications, since SLID bonds can tolerate higher temperatures than the bonding temperature. SLID uses a layered binary metal structure, ...