dc.contributor.author | Aasmundtveit, Knut | |
dc.contributor.author | Luu, Thi Thuy | |
dc.contributor.author | Nguyen, Hoang-Vu | |
dc.contributor.author | Larsson, Andreas | |
dc.contributor.author | Tollefsen, Torleif Andre | |
dc.date.accessioned | 2020-07-01T12:20:22Z | |
dc.date.available | 2020-07-01T12:20:22Z | |
dc.date.created | 2020-03-25T16:07:08Z | |
dc.date.issued | 2019 | |
dc.identifier.citation | Aasmundtveit, K. E., Luu, T., Nguyen, H., Larsson, A., & Tollefsen, T. A. (2019, 28-31 May 2019). Solid-Liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications. Paper presented at the 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). | en_US |
dc.identifier.isbn | 978-1-7281-1499-6 | |
dc.identifier.uri | https://hdl.handle.net/11250/2660345 | |
dc.description.abstract | Solid-Liquid InterDiffusion (SLID) bonding is particularly suited for high-temperature applications, since SLID bonds can tolerate higher temperatures than the bonding temperature. SLID uses a layered binary metal structure, which reacts to high-temperature stable intermetallics at normal solder temperatures. Hence, high-temperature stability is achievable for a process at moderate bonding temperatures. Alternatively, low-temperature SLID bonding (bonding down to ~100 °C) allows bonding of temperature-sensitive components and materials, without restricting the application temperature range. Cu-Sn is the most mature SLID system. We show optimized Cu-Sn SLID bonding for vacuum encapsulation of MEMS devices. Au-Sn SLID has superior oxidation resistance, and we demonstrate that Au-Sn SLID has excellent reliability when bonding thermally mismatched chips and substrates. We demonstrate Ni-Sn SLID bonding, as well as the low-temperature alternatives Au-In and Au-In-Bi. For Cu-Sn, Au-Sn and Au-In SLID, we show experimental evidence for the high-temperature stability predicted from phase diagrams. | en_US |
dc.language.iso | eng | en_US |
dc.relation.ispartof | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) | |
dc.title | Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications | en_US |
dc.type | Chapter | en_US |
dc.description.version | acceptedVersion | en_US |
dc.rights.holder | IEEE | en_US |
dc.source.journal | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) | en_US |
dc.identifier.doi | 10.1109/ECTC.2019.00029 | |
dc.identifier.cristin | 1803565 | |
cristin.ispublished | true | |
cristin.fulltext | postprint | |
cristin.qualitycode | 1 | |